Product design
- Material: Tachyon100G
- Layer count: 8L
- Construction: Plus 2 HDI
- Via: Copper filling, hole plugging
- Final finish: ENIG+ gold plating
- Board Thickness: 1.0mm
- Line width/space: 3.6/6.4
- Minimum drill bit: 0.15mm
- Aspect ratio: 6.6:1
Product application
QSFP-DD(Quad Small Form-factor Pluggable-Double Density) has a four-channel SFP-DD interface, a single-channel transmission rate of 56Gbps, and a transmission rate of 100Gbps. It is applicable to high-performance switch, router, server and host bus adapter in calculation and telecom application, with enterprise storage, high density, high-speed I/O, and multi-channel interconnection
| Surface Finishes |
| Electroless Nickel Immersion Gold (ENIG) |
| Hot Air Solder Level (HASL, Lead and Lead‐free) |
| OSP, Immersion Tin,Immersion Silver, ENEPIG |
| Gold Fingers, Flash Gold, Full Body Hard Gold, Wire Bondable Gold |
| Selective and Multiple Surface Finishes, Carbon Ink, Peelable SM |
| Standard | Advanced | Capability | Standard | Advanced | Capability | Standard | Advanced |
| 2.36/2.36mil | 2.0/2.0mil | NPth Aperture size | ±2mil | ±1.5mil | Min. SMT/QFP Pitch | 10mil | NA |
| 2oz | 4oz | Hole location Accuracy | ±3mil | ±2mil | Min. BGA Pitch | 12mil | NA |
| Min：0.2mm | Min：0.15mm | Distance from the center of the hole to the center of the hole | ±4mil | ±3mil | Max. Test Points/Board(Universal ET) | Bed of Nail Test：16000 | NA |
| Min：0.1mm | Min：0.05mm | Hole to Edge Precision | ±3mil | ±2mil | Flying Probe Test：1-∞ | ||
| Min：0.45mm | Min：0.40mm | Layer to layer registration | ±4mil | ±3mil | v-cut Depthing | ±4mil | ±3mil |
| 4-16 layer | 24 layer | Shape Size tolerance | ±4mil | ±3mil | v-cut Angel | 20°、30°、45° | NA |
| 520mmX620mm | 540mmX640mm | Impedance tolerances | ±10% | ±8% | v-cut precision | ±4mil | ±3mil |
| 8:01 | 10:01 | Min.Solder Mask Dam Width | Green Oil：3mil | Green Oil：2.5mil | |||
| ±20% | ±10% | Other：4.5mil | Other：4mil | ||||
| ±3mil | ±2mil | S/M Registration | ±1.5mil | ±1.2mil |