Professional HDI PCB Manufacturer

Product design

  • Layers: 8L(1+6+1)
  • Material: DS7402
  • Thickness: 1.0mm
  • Hole/pad:
  • Drill 200/400um
  • Laser 100/250um
  • L/W:
  • Inn. 100/100μm
  • Out 95/100μm
  • S/M: Green

Product application

High Density Interconnection (HDI)  products can be used in  electronic computing and storage devices

 

Surface Finishes
Electroless Nickel Immersion Gold (ENIG)
Hot Air Solder Level (HASL, Lead and Lead‐free)
OSP, Immersion Tin,Immersion Silver, ENEPIG
Gold Fingers, Flash Gold, Full Body Hard Gold, Wire Bondable Gold
Selective and Multiple Surface Finishes, Carbon Ink, Peelable SM
Capability Standard Advanced Capability Standard Advanced Capability Standard Advanced
Line width space 2.36/2.36mil 2.0/2.0mil NPth Aperture size ±2mil ±1.5mil Min. SMT/QFP Pitch 10mil NA
Max Copper foil thickness 2oz 4oz Hole location Accuracy ±3mil ±2mil Min. BGA Pitch 12mil NA
Min. via hole  size Min:0.2mm Min:0.15mm Distance from the center of the hole to the center of the hole ±4mil ±3mil

Max. Test Points/Board

(Universal ET)

Bed of Nail Test:16000 NA
Min. blind hole size Min:0.1mm Min:0.05mm Hole to Edge Precision ±3mil ±2mil Flying Probe Test:1-∞
Minimum semi-metallized hole Min:0.45mm Min:0.40mm Layer to layer registration ±4mil ±3mil v-cut Depthing ±4mil ±3mil
Buried hole 4-16 layer 24 layer Shape Size tolerance ±4mil ±3mil v-cut  Angel 20°、30°、45° NA
Max production borad size 520mmX620mm 540mmX640mm Impedance tolerances ±10% ±8% v-cut precision ±4mil ±3mil
Max Aspect ratio 8:01 10:01 Min.Solder Mask Dam Width Green Oil:3mil Green Oil:2.5mil      
line width space ±20% ±10% Other:4.5mil Other:4mil        
Pth Aperture size ±3mil ±2mil S/M Registration ±1.5mil ±1.2mil