Product design
- Layers: 8L(1+6+1)
- Material: DS7402
- Thickness: 1.0mm
- Hole/pad:
- Drill 200/400um
- Laser 100/250um
- L/W:
- Inn. 100/100μm
- Out 95/100μm
- S/M: Green
Product application
High Density Interconnection (HDI) products can be used in electronic computing and storage devices
| Surface Finishes |
| Electroless Nickel Immersion Gold (ENIG) |
| Hot Air Solder Level (HASL, Lead and Lead‐free) |
| OSP, Immersion Tin,Immersion Silver, ENEPIG |
| Gold Fingers, Flash Gold, Full Body Hard Gold, Wire Bondable Gold |
| Selective and Multiple Surface Finishes, Carbon Ink, Peelable SM |
| Capability | Standard | Advanced | Capability | Standard | Advanced | Capability | Standard | Advanced |
| Line width space | 2.36/2.36mil | 2.0/2.0mil | NPth Aperture size | ±2mil | ±1.5mil | Min. SMT/QFP Pitch | 10mil | NA |
| Max Copper foil thickness | 2oz | 4oz | Hole location Accuracy | ±3mil | ±2mil | Min. BGA Pitch | 12mil | NA |
| Min. via hole size | Min：0.2mm | Min：0.15mm | Distance from the center of the hole to the center of the hole | ±4mil | ±3mil |
Max. Test Points/Board (Universal ET) |
Bed of Nail Test：16000 | NA |
| Min. blind hole size | Min：0.1mm | Min：0.05mm | Hole to Edge Precision | ±3mil | ±2mil | Flying Probe Test：1-∞ | ||
| Minimum semi-metallized hole | Min：0.45mm | Min：0.40mm | Layer to layer registration | ±4mil | ±3mil | v-cut Depthing | ±4mil | ±3mil |
| Buried hole | 4-16 layer | 24 layer | Shape Size tolerance | ±4mil | ±3mil | v-cut Angel | 20°、30°、45° | NA |
| Max production borad size | 520mmX620mm | 540mmX640mm | Impedance tolerances | ±10% | ±8% | v-cut precision | ±4mil | ±3mil |
| Max Aspect ratio | 8:01 | 10:01 | Min.Solder Mask Dam Width | Green Oil：3mil | Green Oil：2.5mil | |||
| line width space | ±20% | ±10% | Other：4.5mil | Other：4mil | ||||
| Pth Aperture size | ±3mil | ±2mil | S/M Registration | ±1.5mil | ±1.2mil |