Product design
- Layers: 8L(3+2+3)
- Material: EM-370(5)
- Material: EM-370(5)
- Hole/pad:
- Drill 200/400um
- Laser 100/250um
- L/W:
- Inn. 100/100μm
- Out 100/100μm
- S/M: Green
Product application
High Density Interconnection (HDI) products can be used in consumer electronics, making the electronics lighter and more intelligent.
Surface Finishes |
Electroless Nickel Immersion Gold (ENIG) |
Hot Air Solder Level (HASL, Lead and Lead‐free) |
OSP, Immersion Tin,Immersion Silver, ENEPIG |
Gold Fingers, Flash Gold, Full Body Hard Gold, Wire Bondable Gold |
Selective and Multiple Surface Finishes, Carbon Ink, Peelable SM |
Capability | Standard | Advanced | Capability | Standard | Advanced | Capability | Standard | Advanced |
Line width space | 2.36/2.36mil | 2.0/2.0mil | NPth Aperture size | ±2mil | ±1.5mil | Min. SMT/QFP Pitch | 10mil | NA |
Max Copper foil thickness | 2oz | 4oz | Hole location Accuracy | ±3mil | ±2mil | Min. BGA Pitch | 12mil | NA |
Min. via hole size | Min:0.2mm | Min:0.15mm | Distance from the center of the hole to the center of the hole | ±4mil | ±3mil |
Max. Test Points/Board (Universal ET) |
Bed of Nail Test:16000 | NA |
Min. blind hole size | Min:0.1mm | Min:0.05mm | Hole to Edge Precision | ±3mil | ±2mil | Flying Probe Test:1-∞ | ||
Minimum semi-metallized hole | Min:0.45mm | Min:0.40mm | Layer to layer registration | ±4mil | ±3mil | v-cut Depthing | ±4mil | ±3mil |
Buried hole | 4-16 layer | 24 layer | Shape Size tolerance | ±4mil | ±3mil | v-cut Angel | 20°、30°、45° | NA |
Max production borad size | 520mmX620mm | 540mmX640mm | Impedance tolerances | ±10% | ±8% | v-cut precision | ±4mil | ±3mil |
Max Aspect ratio | 8:01 | 10:01 | Min.Solder Mask Dam Width | Green Oil:3mil | Green Oil:2.5mil | |||
line width space | ±20% | ±10% | Other:4.5mil | Other:4mil | ||||
Pth Aperture size | ±3mil | ±2mil | S/M Registration | ±1.5mil | ±1.2mil |