Product design
Layers: 10L
Board thickness: 1.0mm±0.075mm
Final finish: Immersion Gold+OSP
Line width/space: 0.063mm/0.63mm
Copper Thickness: 1oz
Application: IoT Module, Half hole, shape accuracy ±0.05mm.
| Surface Finishes Capability | |
|---|---|
| Layer Count: 2-24 Layers | |
| Board Thickness: 0.2-3.2mm | |
| High Density Interconnection: 1+n+1,1+1+n+1+1,2+n+2，3+n+3,4+n+4 | |
| Material: EMC, NANYA, SYTECH, ITEQ, TUC, DOOSAN, ROGERS, MGC, Showa Denko, ISOLA, VENTEC | |
| Environmental Products: HDI ROHS ，halogen- free | |
| ENIG(Electroless Nickel/Immersion Gold) ，Au/Ni Immersion 1 to 8 u〞，Ni：120-250 u〞 | |
| Organic Solder ability Preservatives，entek plus Ht,Preflux F2 Lx（0.2-0.5um） | |
| Electric nickel gold（ Soft Gold,Hard Gold ），Connecting Finge | |
| HASL-lead free Sn thickness 1-40um | |
| Printing dynamic QR code | |
| Liquid photosensitive solder prevent mask | |
| May Peeling off solder mask | |
| Electric Conductive Carbon oil |
| Capability | Standard | Advanced | Capability | Standard | Advanced | Capability | Standard | Advanced |
|---|---|---|---|---|---|---|---|---|
| Line width space | 2.36/2.36mil | 2.0/2.0mil | NPth Aperture size | ±2mil | ±1.5mil | Min. SMT/QFP Pitch | 10mil | NA |
| Max Copper foil thickness | 2oz | 4oz | Hole location Accuracy | ±3mil | ±2mil | Min. BGA Pitch | 12mil | NA |
| Min. via hole size | Min：0.2mm | Min：0.15mm | Distance from the center of the hole to the center of the hole | ±4mil | ±3mil |
Max. Test Points/Board (Universal ET) |
Bed of Nail Test：16000 | NA |
| Min. blind hole size | Min：0.1mm | Min：0.05mm | Hole to Edge Precision | ±3mil | ±2mil | Flying Probe Test：1-∞ | ||
| Minimum semi-metallized hole | Min：0.45mm | Min：0.40mm | Layer to layer registration | ±4mil | ±3mil | v-cut Depthing | ±4mil | ±3mil |
| Buried hole | 4-16 layer | 24 layer | Shape Size tolerance | ±4mil | ±3mil | v-cut Angel | 20°、30°、45° | NA |
| Max production borad size | 520mmX620mm | 540mmX640mm | Impedance tolerances | ±10% | ±8% | v-cut precision | ±4mil | ±3mil |
| Max Aspect ratio | 8:01 | 10:01 | Min.Solder Mask Dam Width | Green Oil：3mil | Green Oil：2.5mil | |||
| line width space | ±20% | ±10% | Other：4.5mil | Other：4mil | ||||
| Pth Aperture size | ±3mil | ±2mil | S/M Registration | ±1.5mil | ±1.2mil |