Product design
- Number of layers: 10 layers (ELIC)
- Material:EM-370(5)
- Thickness:0.7mm
- Hole/pad:200/400μm
- Laser75/200μm
- Inn. 50/50μm
- Out50/75μm
- S/M: Black
Product application
Any layer of interconnect board products can be applied to mobile communication terminals, which integrates a variety of circuits, enabling mobile terminals to handle complex tasks and have rich communication methods. With the development of communication technologies, mobile terminals have become modern Internet services. The main platform.
Surface Finishes |
Electroless Nickel Immersion Gold (ENIG) |
Hot Air Solder Level (HASL, Lead and Lead‐free) |
OSP, Immersion Tin,Immersion Silver, ENEPIG |
Gold Fingers, Flash Gold, Full Body Hard Gold, Wire Bondable Gold |
Selective and Multiple Surface Finishes, Carbon Ink, Peelable SM |
Capability | Standard | Advanced | Capability | Standard | Advanced | Capability | Standard | Advanced |
Line width space | 2.36/2.36mil | 2.0/2.0mil | NPth Aperture size | ±2mil | ±1.5mil | Min. SMT/QFP Pitch | 10mil | NA |
Max Copper foil thickness | 2oz | 4oz | Hole location Accuracy | ±3mil | ±2mil | Min. BGA Pitch | 12mil | NA |
Min. via hole size | Min:0.2mm | Min:0.15mm | Distance from the center of the hole to the center of the hole | ±4mil | ±3mil |
Max. Test Points/Board (Universal ET) |
Bed of Nail Test:16000 | NA |
Min. blind hole size | Min:0.1mm | Min:0.05mm | Hole to Edge Precision | ±3mil | ±2mil | Flying Probe Test:1-∞ | ||
Minimum semi-metallized hole | Min:0.45mm | Min:0.40mm | Layer to layer registration | ±4mil | ±3mil | v-cut Depthing | ±4mil | ±3mil |
Buried hole | 4-16 layer | 24 layer | Shape Size tolerance | ±4mil | ±3mil | v-cut Angel | 20°、30°、45° | NA |
Max production borad size | 520mmX620mm | 540mmX640mm | Impedance tolerances | ±10% | ±8% | v-cut precision | ±4mil | ±3mil |
Max Aspect ratio | 8:01 | 10:01 | Min.Solder Mask Dam Width | Green Oil:3mil | Green Oil:2.5mil | |||
line width space | ±20% | ±10% | Other:4.5mil | Other:4mil | ||||
Pth Aperture size | ±3mil | ±2mil | S/M Registration | ±1.5mil | ±1.2mil |