Professional HDI PCB Manufacturer

Product design

 

  • Material: IT200LK
  • Layers: 10L
  • Surface finish: OSP
  • Thickness: 1.69mm
  • Size: 17.64×17.97inch
  • LW/S: 3.5mil/4mil (processing difficulty: line)
  • Min drill bit: 0.25mm

 

Product application

14G main board, mainly applied in Bank、Telecom、Internet data center areas etc.

 

Surface Finishes
Electroless Nickel Immersion Gold (ENIG)
Hot Air Solder Level (HASL, Lead and Lead‐free)
OSP, Immersion Tin,Immersion Silver, ENEPIG
Gold Fingers, Flash Gold, Full Body Hard Gold, Wire Bondable Gold
Selective and Multiple Surface Finishes, Carbon Ink, Peelable SM

 

Standard Advanced Capability Standard Advanced Capability Standard Advanced
2.36/2.36mil 2.0/2.0mil NPth Aperture size ±2mil ±1.5mil Min. SMT/QFP Pitch 10mil NA
2oz 4oz Hole location Accuracy ±3mil ±2mil Min. BGA Pitch 12mil NA
Min:0.2mm Min:0.15mm Distance from the center of the hole to the center of the hole ±4mil ±3mil Max. Test Points/Board(Universal ET) Bed of Nail Test:16000 NA
Min:0.1mm Min:0.05mm Hole to Edge Precision ±3mil ±2mil Flying Probe Test:1-∞
Min:0.45mm Min:0.40mm Layer to layer registration ±4mil ±3mil v-cut Depthing ±4mil ±3mil
4-16 layer 24 layer Shape Size tolerance ±4mil ±3mil v-cut  Angel 20°、30°、45° NA
520mmX620mm 540mmX640mm Impedance tolerances ±10% ±8% v-cut precision ±4mil ±3mil
8:01 10:01 Min.Solder Mask Dam Width Green Oil:3mil Green Oil:2.5mil      
±20% ±10% Other:4.5mil Other:4mil        
±3mil ±2mil S/M Registration ±1.5mil ±1.2mil